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Create a Profile for the C3 Community

If you would like to participate in the SSP C3 Community platform and you are not or have not been an SSP member or registered for an SSP event in the recent past, you will need to create a SSP Profile. If you believe that you may already have a profile on record with SSP, please login using your username and password. If you're unsure of your log in information, you can retrieve them on the login page .

To create a profile, enter your information on the Create a Profile page. 

Upon completion, you will be redirected to the Community Rules and Etiquette for the platform. After clicking "I agree," you’ll be directed to the All Communities page, where you can join the Industry Announcements and Events community. If your organization is member of SSP, you’ll also be able to access the Member Exchange community.

Latest from Industry Events and Announcements

  • Publishing CareerBuilder: Museum Publishing Careers Wednesday, April 2 · 6 - 7pm EDT - via zoom Learn about the range of career paths and the skills and experience helpful for a rewarding career in museum publishing. This Publishing ... More

  • **Apologies for cross posting** As we pursue our mission to develop authoritative standards for the information community, we want to ensure that our work reflects the needs of libraries, content providers, aggregators, scholarly infrastructure ... More

  • The 2025 SSP Leadership Academy is just around the corner, starting on Thursday! This unique virtual training will equip you with leadership skills needed to thrive in the evolving world of scholarly publishing. Whether you want to step into a ... More

  • Silverchair's free spring webinar series is entering its sixth year, exploring the technologies and strategies that support professional and scholarly knowledge. This year, we'll be focusing on practical considerations around accessibility, research ... More

  • Join us on Thursday, February 13 at 11:00 am ET for a free showcase highlighting new and exciting industry innovations . Sponsors and speakers will present their solutions in under ten minutes, providing a unique opportunity to glimpse the latest ... More

News from SSP

  • National Recognition for CCC’s “People-First” Workplace Culture CCC, a leader in advancing copyright, accelerating knowledge, and powering innovation, has been named to the USA Today Top Workplaces 2025 list for the fourth consecutive year as a result of its “fostering a workplace The post USA Today Names CCC a Top Workplace for the Fourth Year in a Row appeared first on SSP Society for Scholarly Publishing .
  • Backlist includes eminent scholars Jane Goodall and Carole Hillenbrand   Paradigm Publishing Services will begin digitally archiving scholarly texts from Edinburgh University Press this year. In 2026, approximately 300 titles from Edinburgh will be available digitally, with more scheduled to be The post Edinburgh University Press Entrusts Paradigm with Archiving 1,600 Books appeared first on SSP Society for Scholarly Publishing .
  • Winners to be announced at the EPIC Awards Celebration on May 29 at SSPs Annual Meeting We are thrilled to announce the finalists for the 2025 Excellence in Publishing, Information Technology, Communications (EPIC) Awards. Launching this year, the EPIC The post Announcing Finalists for the 2025 EPIC Awards appeared first on SSP Society for Scholarly Publishing .
  • National Volunteer Week is a perfect time to recognize our dedicated members and support the work they do. The post Thank You, Volunteers—You Make SSP’s Work Possible appeared first on SSP Society for Scholarly Publishing .
  • eWorkflow Ltd, an artificial intelligence-based manuscript submission system, has partnered with Clear Skies Ltd to integrate their Papermill Alarm. All manuscripts submitted via eWorkflow will now be screened using Clear Skies’ multi-award-winning research integrity checks. Dr Riaz Agha, Founder and The post eWorkflow Partners with Clear Skies to Integrate Papermill Alarm appeared first on SSP Society for Scholarly Publishing .